Tantalum sputtering targets are sputtering coating materials made from high-purity tantalum metal. In semiconductor chip manufacturing, they serve as the diffusion barrier layer for copper interconnects, preventing copper atoms from diffusing into the silicon substrate, and are an indispensable c...
In thin-film deposition processes, the dimensional selection of sputtering targets is often the first issue encountered by procurement and process engineers. Whether building a laboratory magnetron sputtering system or maintaining the coating throughput of a large-scale production line, the diame...
1. Why Atomic Ratio and Weight Ratio Must Be Clearly Distinguished
In the procurement and technical communication of TiAl targets, there is a question that comes up almost every day: a customer says, “I want a TiAl 50/50 target,” and the supplier has to ask, “Do you mean atomic ratio or weight ra...
Aluminum plays the role of a “light yet conductive” element in the periodic table. Pure aluminum has a resistivity of about 2.65 μΩ·cm, second only to silver and copper, yet its cost is much lower, and its adhesion to silicon wafers and glass is also good. These foundations make aluminum-based fi...
In modern advanced manufacturing, copper (Cu) and its alloy targets are among the most widely used metal targets in physical vapor deposition (PVD) technology. Due to their excellent electrical conductivity, thermal conductivity, ductility, and low resistivity, copper targets have become the core...
In modern advanced manufacturing, chromium (Cr) and its alloy targets serve as indispensable core materials for physical vapor deposition (PVD) technology, particularly magnetron sputtering processes. They act as “converters,” transforming high-purity metals or alloys into functional ...
In the fields of precision coating and semiconductor manufacturing, Physical Vapor Deposition (PVD) technology—particularly magnetron sputtering—has become the core method for producing high-performance functional thin films. In this process, the sputtering target serves as the “source mate...
Chromium is a silver white glossy metal, high purity chromium having certain ductility. Chromium containing impurities is hard and brittle, and can be dissolved in strong alkaline solutions. Chromium has high corrosion resistance, and in air, even in a hot state, it oxidizes slowly and is insolub...
In magnetron sputtering processes, target-to-backing-plate bonding is often treated as a secondary “auxiliary step” and receives insufficient attention. However, in actual production, issues such as target delamination, localized burn-through, non-uniform film thickness, and target cr...
Chromium‑aluminum alloy sputtering targets (commonly referred to as CrAl targets or AlCr targets) are high‑performance alloy sputtering source materials widely used in physical vapor deposition (PVD) processes. Through magnetron sputtering or arc evaporation, these targets deposit functional film...
In the advanced ceramics and vacuum coating industry, there is a material that breaks through the performance limitations of traditional ceramics—”hard but brittle”—and metals—”temperature-limited and wear-prone.” It has become an ideal choice for extreme operating conditi...
As a critical consumable in physical vapor deposition (PVD) processes, the quality of molybdenum sputtering targets directly determines the performance and yield of thin-film devices. With flat panel displays evolving toward larger sizes and higher resolutions, and semiconductor processes becomin...