NiV Sputtering Target High Purity Thin Film Pvd Coating Custom Made

Gold is often applicated in the deposition of integrated circuit layer, but AuSi low-melting compound is often formed if Gold is combined with Silicon, which would cause the looseness between different layers. Pure Nickel is a good choice for Adhesive layer, while a Barrier layer is also required between the Nickel and Gold layer to prevent proliferation. Vanadium could perfectly satisfy this requirement with high melting point and capacity of standing high ampere density. Therefore Nickel, Vanadium and Gold are three materials usually applicated in integrated circuit industry. Nickel Vanadium Sputtering Target is manufactured by adding Vanadium into molten Nickel. With low ferromagnetism, it is a good choice for the magnetron sputtering of electronic products, which could produce Nickel layer and Vanadium layer in one time.