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CuW Sputtering Target High Purity Thin Film Pvd Coating Custom Made

Copper Tungsten

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Alloy Sputtering Target

Chemical Formula



Copper Tungsten




Plates,Column Targets,arc cathodes,Custom-made

Production Process


Available Size


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Copper Tungsten alloy sputtering target is fabricated by means of powder metallurgy. The content of copper ranges mostly between 10% and 50%. It has excellent thermal and electric conductivity, high temperature strength and ductility. At very high temperatures, such as above 3000°C, the copper in the alloy is liquefied and evaporated, absorbing a large amount of heat, and reducing the surface temperature of the material. This kind of material is also called metal sweating material.

Since the two metals of Tungsten and Copper are incompatible with each other, Copper-Tungsten alloy has the low expansion, wear resistance, corrosion resistance of tungsten and the high electrical and thermal conductivity of copper, and it is suitable for various mechanical processing. Copper Tungsten alloys can be produced according to user requirements for Copper-Tungsten ratio production and size processing. Copper-Tungsten alloys generally use powder metallurgy processes to prepare powder-batch mixing-press molding-sintering infiltration.

Rich Special Materials specializes in the Manufacture of Sputtering Target and could produce Copper-Tungsten Sputtering Materials according to Customers’ specifications. For more information, please contact us.

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