Wholesale Price High Entropy Alloys - Tanb Sputtering Target High Purity Thin Film Pvd Coating Custom Made – Rich
Wholesale Price High Entropy Alloys - Tanb Sputtering Target High Purity Thin Film Pvd Coating Custom Made – Rich Detail:
Tantalum Niobium Sputtering Target Description
Tantalum Niobium sputtering target is fabricated by means of vacuum melting of Tantalum and Niobium. These two are high melting point( Tantalum 2996℃, Niobium 2468℃), high boiling point(Tantalum 5427℃, Niobium 5127℃) rare metals. Tantalum Niobium alloy has the similar appearance with steel, it has a silver-gray lustre(while the powder is dark grey) . It has many favorable properties: corrosion resistance, superconductivity, and high temperature strength. So any applications or industries could benefit from using Tantalum Niobium alloys, such as electronics, glass & optics, aerospace, medical device, superconductivity and steel.
Tantalum and Niobium have been crucial in the space industry for years due to their impressive strength, corrosion resistance and other attractive features, and have been used in many important components like rocket engines and nozzles.
Tantalum Niobium Sputtering Target Packaging
Our TaNb sputter target is clearly tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage which might be caused during storage or transportation.
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RSM’s Tantalum Niobium sputtering targets are of ultra-high purity and uniform. They are available in various forms, purities, sizes, and prices. We specialize in producing high purity thin film coating materials with excellent performance as well as the highest possible density and smallest possible average grain sizes for use in mold coating、decoration、automobile parts、low-E glass、semi-conductor integrated circuit、thin film resistance、graphic display、aerospace、 magnetic recording、touch screen、thin film solar battery and other physical vapor deposition (PVD) applications. Please send us an inquiry for current pricing on sputtering targets and other deposition materials not listed.
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