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Market demand for metal sputtering targets for the flat panel display industry

Thin-film transistor LCD panels are currently the mainstream planar display technology, and metal sputtering targets are one of the most critical materials in the manufacturing process.At present, the metal sputtering targets used in the domestic mainstream LCD panel production line has the greatest demand for four kinds of targets such as aluminum, copper, molybdenum and molybdenum niobium alloy.Next,Let the editor of Beijing Rich company introduce the market demand for metal sputtering targets in the flat display industry.


  一、Aluminum targets:

At present, aluminum targets for the domestic LCD industry are mainly dominated by Japanese-funded enterprises. In terms of foreign companies: Aifaco Electronic Materials Co., Ltd. occupies about 50% of the domestic market share.Secondly, Sumitomo Chemical also has a part of the market share. In terms of Domestic: Jiangfeng Electronics began to intervene in aluminum targets around 2013, and has been supplied in large quantities, and is a leading enterprise of domestic aluminum targets.In addition, Nanshan Aluminum, Xinjiang Zhonghe and other enterprises also have the capacity of high-purity aluminum production .

二、Copper targets

From the development trend of sputtering process, the proportion of demand for copper targets has been gradually increasing, with the fact that the market scale of the domestic LCD industry has been expanding in recent years, therefore, the demand for copper targets in the flat panel display industry will continue to show an upward trend:

三、Wide-band molybdenum targets

In terms of foreign enterprises: foreign enterprises such as Panshi and Shitaike basically monopolize the domestic wide-format molybdenum target market. Domestic: By the end of 2018, the localization of wide-format molybdenum targets has been practically applied in the production of liquid crystal display panels.

四、Molybdenum – columbium-10 alloy targets

Molybdenum-niobium-10 alloy is an important alternative material for the diffusion barrier layer of thin-film transistors, and its market demand prospects are better.However, due to the great difference in the mutual diffusion coefficients of molybdenum atoms and niobium atoms, the position of niobium particles after high temperature sintering will produce large holes, and the sintering density is difficult to increase.In addition, the full diffusion of molybdenum atoms and niobium atoms will form a strong solid solution strengthening, resulting in deterioration of their calendering performance. However, Xi’an Ruiflair Tungsten Molybdenum Co., Ltd., a subsidiary of Western Metal Materials Co., Ltd., cooperates with AIFACO Electronic Materials (Suzhou) Co., Ltd. After many tests, the oxygen content of less than 1000 ×101 has been successfully rolled out in 2017, and the density has reached 99. 3% Mo-Nb alloy blank.

Post time: Apr-18-2022