Sputtered target materials have high requirements during use, not only for purity and particle size, but also for uniform particle size. These high requirements make us pay more attention when using sputtering target materials.
1. Sputtering preparation
It is very important to maintain the cleanliness of the vacuum chamber, especially the sputtering system. Lubricants, dust, and any residue from previous coatings can accumulate pollutants such as water, directly affecting the vacuum and increasing the likelihood of film formation failure. Short circuits, target arcing, rough film-forming surfaces, and excessive chemical impurities are usually caused by unclean sputtering chambers, guns, and targets.
In order to maintain the compositional characteristics of the coating, the sputtering gas (argon or oxygen) must be clean and dry. After installing the substrate in the sputtering chamber, air needs to be extracted to achieve the required vacuum level for the process.
2. Target cleaning
The purpose of target cleaning is to remove any dust or dirt that may exist on the surface of the target.
3. Target installation
The most important thing to pay attention to during the installation process of the target material is to ensure a good thermal connection between the target material and the cooling wall of the sputtering gun. If the cooling wall or back plate is severely warped, it may cause cracking or bending during the installation of the target material. The heat transfer from the back target to the target material will be greatly affected, resulting in the inability to dissipate heat during sputtering, ultimately leading to cracking or deviation of the target material.
4. Short circuit and sealing inspection
After the installation of the target material, it is necessary to check the short circuit and sealing of the entire cathode. It is recommended to use an ohmmeter and a megohmmeter to determine if the cathode is short circuited. After confirming that the cathode is not short circuited, a leak detection can be carried out by injecting water into the cathode to determine if there is any leakage.
5. Target material pre sputtering
It is recommended to use pure argon gas for pre sputtering of the target material, which can clean the surface of the target material. It is recommended to slowly increase the sputtering power during the pre sputtering process for the target material. The power of the ceramic target material
Post time: Oct-19-2023