Tantalum sputtering targets are sputtering coating materials made from high-purity tantalum metal. In semiconductor chip manufacturing, they serve as the diffusion barrier layer for copper interconnects, preventing copper atoms from diffusing into the silicon substrate, and are an indispensable core consumable for advanced process nodes. Their purity is typically required to be above 4N (99.99%), with high-end applications reaching the 5N (99.999%) level. we can manufacture 99.95%to 99.99% Tantalum sputtering targets.
Tantalum targets are produced through the powder metallurgy method.
Step 1: Selection of High-Purity Tantalum Powder
High-purity tantalum powder is selected and weighed for batching.
Step 2: Forming
The high-purity tantalum powder is loaded into a sheath for cold isostatic pressing (CIP) pre-forming, or directly subjected to vacuum hot-press sintering. Some processes also adopt a route combining hydrogenated tantalum powder with cold isostatic pressing and hot isostatic pressing (HIP).
Step 3: Sintering and Densification
High-temperature sintering is carried out under vacuum or an inert atmosphere to form metallurgical bonding between powder particles and achieve a density close to theoretical density. Hot isostatic pressing can achieve higher density and a more uniform structure at lower temperatures.
Step 4: Subsequent Processing
Mechanical machining (turning, grinding, polishing) is performed to reach the final dimensions and surface roughness requirements, followed by welding and bonding with a backing plate (copper or aluminum) to form a target assembly.
Semiconductor Copper Interconnect Barrier Layer: Tantalum does not react with copper or diffuse to form compounds. A tantalum thin film can effectively prevent copper from diffusing into the silicon substrate, making it the standard barrier layer material for interconnect structures in advanced logic chips and memory chips. As process nodes advance, requirements for barrier layer thickness uniformity and sheet resistance consistency continue to increase.
Matching Tantalum Rings: High-purity tantalum magnetron sputtering rings are used together with tantalum targets to constrain the trajectory of sputtered particles and adsorb large particles falling from the edges, reducing substrate contamination. We can supply matching ring components simultaneously to ensure material compatibility with the target.
Why Contact Us
- Source Manufacturing: In-house production lines control key processes, ensuring controllable lead times
- Flexible Specifications: Purity, size, and shape customized to requirements
- Technical Support: Sputtering parameter matching recommendations and inspection data provided
Post time: Oct-24-2026